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1. general description the 74lvc2g241 is a high-performance, low-power, low-voltage, si-gate cmos device and superior to most advanced cmos compatible ttl families. inputs can be driven from either 3.3 v or 5 v devices. this feature allows the use of these devices as translators in a mixed 3.3 v and 5 v environment. this device is fully speci?ed for partial power-down applications using i off . the i off circuitry disables the output, preventing the damaging back?ow current through the device when it is powered down. the 74lvc2g241 is a dual non-inverting buffer/line driver with 3-state outputs. the 3-state outputs are controlled by the output enable inputs 1 oe and 2oe. a high level at pin 1 oe causes output 1y to assume a high-impedance off-state. a low level at pin 2oe causes output 2y to assume a high-impedance off-state. schmitt-trigger action at all inputs makes the circuit highly tolerant for slower input rise and fall times. 2. features n wide supply voltage range from 1.65 v to 5.5 v n 5 v tolerant input/output for interfacing with 5 v logic n high noise immunity n complies with jedec standard: u jesd8-7 (1.65 v to 1.95 v) u jesd8-5 (2.3 v to 2.7 v) u jesd8-b/jesd36 (2.7 v to 3.6 v) n esd protection: u hbm jesd22-a114-d exceeds 2000 v u mm jesd22-a115-a exceeds 200 v n 24 ma output drive (v cc = 3.0 v) n cmos low power consumption n latch-up performance exceeds 250 ma n direct interface with ttl levels n inputs accept voltages up to 5 v n multiple package options n speci?ed from - 40 cto+85 c and - 40 c to +125 c 74lvc2g241 dual buffer/line driver; 3-state rev. 06 22 september 2006 product data sheet
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 2 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state 3. ordering information 4. marking 5. functional diagram table 1. ordering information type number package temperature range name description version 74lvc2g241dp - 40 c to +125 c tssop8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm sot505-2 74lvc2g241dc - 40 c to +125 c vssop8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765-1 74lvc2g241gt - 40 c to +125 c xson8 plastic extremely thin small outline package; no leads; 8 terminals; body 1 1.95 0.5 mm sot833-1 74lvc2g241gm - 40 c to +125 c xqfn8 plastic extremely thin quad ?at package; no leads; 8 terminals; body 1.6 1.6 0.5 mm sot902-1 table 2. marking type number marking code 74lvc2g241dp v241 74lvc2g241dc v41 74lvc2g241gt v41 74lvc2g241gm v41 fig 1. logic symbol fig 2. iec logic symbol 001aaa409 1oe 1y 1 26 1a 2oe 2y 7 53 2a 001aaa408 1 en1 en2 1 2 6 2 7 3 5
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 3 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state 6. pinning information 6.1 pinning 6.2 pin description fig 3. pin con?guration sot505-2 (tssop8) and sot765-1 (vssop8) 74lvc2g241 1oe v cc 1a 2oe 2y 1y gnd 2a 001aab569 1 2 3 4 6 5 8 7 fig 4. pin con?guration sot833-1 (xson8) fig 5. pin con?guration sot902-1 (xqfn8) 74lvc2g241 1y 2oe v cc 2a 2y 1a 1oe gnd 001aab570 36 27 18 45 transparent top view 001aaf057 1a 1y 1oe v cc 2y 2oe gnd 2a transparent top view 3 6 4 1 5 8 7 2 terminal 1 index area 74lvc2g241 table 3. pin description symbol pin description sot505-2, sot765-1, sot833-1 sot902-1 1 oe 1 7 output enable input 1 oe (active low) 1a 2 6 data input 1a 2y 3 5 data output 2y gnd 4 4 ground (0 v) 2a 5 3 data input 2a 1y 6 2 data output 1y 2oe 7 1 output enable input 2oe (active high) v cc 8 8 supply voltage
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 4 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state 7. functional description [1] h = high voltage level; l = low voltage level; x = dont care; z = high-impedance off-state. 8. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] when v cc = 0 v (power-down mode), the output voltage can be 5.5 v in normal operation. [3] for tssop8 packages: above 55 c the value of p tot derates linearly with 2.5 mw/k. for vssop8 packages: above 110 c the value of p tot derates linearly with 8.0 mw/k. for xson8 and xqfn8 packages: above 45 c the value of p tot derates linearly with 2.4 mw/k. table 4. function table [1] input output 1 oe 1a 2oe 2a 1y 2y llhlll l hhhhh hxl xz z table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +6.5 v i ik input clamping current v i < 0 v - - 50 ma v i input voltage [1] - 0.5 +6.5 v i ok output clamping current v o > v cc or v o <0 v - 50 ma v o output voltage enable mode [1] [2] - 0.5 v cc + 0.5 v disable mode [1] [2] - 0.5 +6.5 v power-down mode [1] [2] - 0.5 +6.5 v i o output current v o = 0 v to v cc - 50 ma i cc supply current - 100 ma i gnd ground current - - 100 ma t stg storage temperature - 65 +150 c p tot total power dissipation t amb = - 40 c to +125 c [3] - 300 mw
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 5 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state 9. recommended operating conditions 10. static characteristics table 6. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 1.65 - 5.5 v v i input voltage 0 - 5.5 v v o output voltage v cc = 1.65 v to 5.5 v; enable mode 0 - v cc v v cc = 1.65 v to 5.5 v; disable mode 0 - 5.5 v v cc = 0 v; power-down mode 0 - 5.5 v t amb ambient temperature - 40 - +125 c d t/ d v input transition rise and fall rate v cc = 1.65 v to 2.7 v 0 - 20 ns/v v cc = 2.7 v to 5.5 v 0 - 10 ns/v table 7. static characteristics at recommended operating conditions; voltages are referenced to gnd (ground 0 v). symbol parameter conditions min typ max unit t amb = - 40 c to +85 c [1] v ih high-level input voltage v cc = 1.65 v to 1.95 v 0.65v cc -- v v cc = 2.3 v to 2.7 v 1.7 - - v v cc = 2.7 v to 3.6 v 2.0 - - v v cc = 4.5 v to 5.5 v 0.7v cc -- v v il low-level input voltage v cc = 1.65 v to 1.95 v - - 0.35v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 2.7 v to 3.6 v - - 0.8 v v cc = 4.5 v to 5.5 v - - 0.3v cc v v ol low-level output voltage v i = v ih or v il i o = 100 m a; v cc = 1.65 v to 5.5 v - - 0.1 v i o = 4 ma; v cc = 1.65 v - - 0.45 v i o = 8 ma; v cc = 2.3 v - - 0.3 v i o = 12 ma; v cc = 2.7 v - - 0.4 v i o = 24 ma; v cc = 3.0 v - - 0.55 v i o = 32 ma; v cc = 4.5 v - - 0.55 v v oh high-level output voltage v i = v ih or v il i o = - 100 m a; v cc = 1.65 v to 5.5 v v cc - 0.1 - - v i o = - 4 ma; v cc = 1.65 v 1.2 - - v i o = - 8 ma; v cc = 2.3 v 1.9 - - v i o = - 12 ma; v cc = 2.7 v 2.2 - - v i o = - 24 ma; v cc = 3.0 v 2.3 - - v i o = - 32 ma; v cc = 4.5 v 3.8 - - v i i input leakage current v i = 5.5 v or gnd; v cc = 5.5 v - 0.1 5 m a
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 6 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state [1] typical values are measured at v cc = 3.3 v and t amb =25 c. i oz off-state output current v i = v ih or v il ; v o = 5.5 v or gnd; v cc = 3.6 v - 0.1 10 m a i off power-off leakage current v i or v o = 5.5 v; v cc =0 v - 0.1 10 m a i cc supply current v i =v cc or gnd; i o = 0 a; v cc = 5.5 v - 0.1 10 m a d i cc additional supply current per pin; v i =v cc - 0.6 v; i o =0a; v cc = 2.3 v to 5.5 v - 5 500 m a c i input capacitance - 2 - pf t amb = - 40 c to +125 c v ih high-level input voltage v cc = 1.65 v to 1.95 v 0.65v cc -- v v cc = 2.3 v to 2.7 v 1.7 - - v v cc = 2.7 v to 3.6 v 2.0 - - v v cc = 4.5 v to 5.5 v 0.7v cc -- v v il low-level input voltage v cc = 1.65 v to 1.95 v - - 0.35v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 2.7 v to 3.6 v - - 0.8 v v cc = 4.5 v to 5.5 v - - 0.3v cc v v ol low-level output voltage v i = v ih or v il i o = 100 m a; v cc = 1.65 v to 5.5 v - - 0.1 v i o = 4 ma; v cc = 1.65 v - - 0.70 v i o = 8 ma; v cc = 2.3 v - - 0.45 v i o = 12 ma; v cc = 2.7 v - - 0.60 v i o = 24 ma; v cc = 3.0 v - - 0.80 v i o = 32 ma; v cc = 4.5 v - - 0.80 v v oh high-level output voltage v i = v ih or v il i o = - 100 m a; v cc = 1.65 v to 5.5 v v cc - 0.1 - - v i o = - 4 ma; v cc = 1.65 v 0.95 - - v i o = - 8 ma; v cc = 2.3 v 1.7 - - v i o = - 12 ma; v cc = 2.7 v 1.9 - - v i o = - 24 ma; v cc = 3.0 v 2.0 - - v i o = - 32 ma; v cc = 4.5 v 3.4 - - v i i input leakage current v i = 5.5 v or gnd; v cc = 5.5 v - - 20 m a i oz off-state output current v i = v ih or v il ; v o = 5.5 v or gnd; v cc = 3.6 v -- 20 m a i off power-off leakage current v i or v o = 5.5 v; v cc =0 v - - 20 m a i cc supply current v i =v cc or gnd; i o = 0 a; v cc = 5.5 v - - 40 m a d i cc additional supply current per pin; v i =v cc - 0.6 v; i o =0a; v cc = 2.3 v to 5.5 v --5ma table 7. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground 0 v). symbol parameter conditions min typ max unit
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 7 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state 11. dynamic characteristics table 8. dynamic characteristics voltages are referenced to gnd (ground 0 v); for test circuit see figure 9 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max t pd propagation delay na to ny; see figure 6 [2] v cc = 1.65 v to 1.95 v 1.0 4.5 8.8 1.0 11.0 ns v cc = 2.3 v to 2.7 v 0.5 2.8 4.9 0.5 6.3 ns v cc = 2.7 v 1.0 2.8 4.7 1.0 5.9 ns v cc = 3.0 v to 3.6 v 0.5 2.6 4.3 0.5 5.4 ns v cc = 4.5 v to 5.5 v 0.5 2.1 3.7 0.5 4.6 ns t en enable time 1 oe to 1y; see figure 7 [3] v cc = 1.65 v to 1.95 v 1.5 5.2 9.9 1.5 12.4 ns v cc = 2.3 v to 2.7 v 1.0 3.1 5.6 1.0 7.0 ns v cc = 2.7 v 1.5 3.2 5.5 1.5 6.9 ns v cc = 3.0 v to 3.6 v 0.5 2.7 4.7 0.5 5.9 ns v cc = 4.5 v to 5.5 v 0.5 2.0 3.8 0.5 4.8 ns 2oe to 2y; see figure 7 [3] v cc = 1.65 v to 1.95 v 1.0 4.3 8.8 1.0 11.0 ns v cc = 2.3 v to 2.7 v 1.0 2.7 4.7 1.0 5.9 ns v cc = 2.7 v 1.0 2.7 4.6 1.0 5.8 ns v cc = 3.0 v to 3.6 v 1.0 2.5 4.1 1.0 5.1 ns v cc = 4.5 v to 5.5 v 0.5 1.9 3.3 0.5 4.1 ns t dis disable time 1 oe to 1y; see figure 7 [4] v cc = 1.65 v to 1.95 v 1.0 3.2 11.6 1.0 14.1 ns v cc = 2.3 v to 2.7 v 0.5 2.2 5.8 0.5 7.6 ns v cc = 2.7 v 1.0 2.8 4.6 1.0 5.9 ns v cc = 3.0 v to 3.6 v 1.0 2.6 4.4 1.0 5.7 ns v cc = 4.5 v to 5.5 v 0.5 2.0 3.4 0.5 4.6 ns 2oe to 2y; see figure 7 [4] v cc = 1.65 v to 1.95 v 1.0 3.6 12.5 1.0 15.2 ns v cc = 2.3 v to 2.7 v 0.5 2.0 5.2 0.5 6.9 ns v cc = 2.7 v 1.5 3.2 4.9 1.5 6.3 ns v cc = 3.0 v to 3.6 v 1.0 2.8 4.2 1.0 5.4 ns v cc = 4.5 v to 5.5 v 0.5 2.0 3.3 0.5 4.4 ns
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 8 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state [1] typical values are measured at nominal v cc and at t amb =25 c. [2] t pd is the same as t plh and t phl . [3] t en is the same as t pzh and t pzl. . [4] t dis is the same as t plz and t phz . [5] c pd is used to determine the dynamic power dissipation (p d in m w). p d = c pd v cc 2 f i n + s (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; s (c l v cc 2 f o ) = sum of outputs. 12. waveforms c pd power dissipation capacitance per buffer; v i = gnd to v cc [5] output enabled - 20 - - - pf output disabled - 5 - - - pf table 8. dynamic characteristics continued voltages are referenced to gnd (ground 0 v); for test circuit see figure 9 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max measurement points are given in t ab le 9 . logic levels: v ol and v oh are typical output voltage drop that occur with the output load. fig 6. the data input (na) to output (ny) propagation delays mna230 t phl t plh v m v m na input ny output gnd v i v oh v ol table 9. measurement points supply voltage input output v cc v m v m v x v y 1.65 v to 1.95 v 0.5v cc 0.5v cc v ol + 0.15 v v oh - 0.15 v 2.3 v to 2.7 v 0.5v cc 0.5v cc v ol + 0.15 v v oh - 0.15 v 2.7 v 1.5 v 1.5 v v ol + 0.3 v v oh - 0.3 v 3.0 v to 3.6 v 1.5 v 1.5 v v ol + 0.3 v v oh - 0.3 v 4.5 v to 5.5 v 0.5v cc 0.5v cc v ol + 0.3 v v oh - 0.3 v
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 9 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state measurement points are given in t ab le 9 . logic levels: v ol and v oh are typical output voltage drop that occur with the output load. fig 7. enable and disable times for input 1 oe mna730 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high 1oe input v ol v oh v cc v i v m gnd gnd t pzl t pzh v m v m measurement points are given in t ab le 9 . logic levels: v ol and v oh are typical output voltage drop that occur with the output load. fig 8. enable and disable times for input 2oe mna731 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high 2oe input v ol v oh v cc v i v m gnd gnd t pzl t pzh v m v m
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 10 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state test data is given in t ab le 10 . de?nitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 9. load circuitry for switching times v ext v cc v i v o mna616 dut c l r t r l r l pulse generator table 10. test data supply voltage input load v ext v i c l r l t plh , t phl t pzh , t phz t pzl , t plz 1.65 v to 1.95 v v cc 30 pf 1 k w open gnd 2 v cc 2.3 v to 2.7 v v cc 30 pf 500 w open gnd 2 v cc 2.7 v 2.7 v 50 pf 500 w open gnd 6 v 3.0 v to 3.6 v 2.7 v 50 pf 500 w open gnd 6 v 4.5 v to 5.5 v v cc 50 pf 500 w open gnd 2 v cc
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 11 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state 13. package outline fig 10. package outline sot505-2 (tssop8) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (1) z (1) q references outline version european projection issue date iec jedec jeita mm 0.15 0.00 0.95 0.75 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.70 0.35 8 0 0.13 0.1 0.2 0.5 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.47 0.33 sot505-2 - - - 02-01-16 w m b p d z e 0.25 14 8 5 q a 2 a 1 l p (a 3 ) detail x a l h e e c v m a x a y 2.5 5 mm 0 scale tssop8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm sot505-2 1.1 pin 1 index
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 12 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state fig 11. package outline sot765-1 (vssop8) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (2) z (1) q references outline version european projection issue date iec jedec jeita mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 0 0.13 0.1 0.2 0.4 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 q 0.21 0.19 sot765-1 mo-187 02-06-07 w m b p d z e 0.12 14 8 5 q a 2 a 1 q l p (a 3 ) detail x a l h e e c v m a x a y 2.5 5 mm 0 scale vssop8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765-1 1 pin 1 index
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 13 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state fig 12. package outline sot833-1 (xson8) terminal 1 index area references outline version european projection issue date iec jedec jeita sot833-1 - - - mo-252 - - - sot833-1 04-07-22 04-11-09 dimensions (mm are the original dimensions) xson8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 2.0 1.9 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.5 0.6 a (1) max 0.5 0.04 1 8 2 7 3 6 4 5 8 (2) 4 (2) a
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 14 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state fig 13. package outline sot902-1 (xqfn8) references outline version european projection issue date iec jedec jeita sot902-1 mo-255 - - - - - - sot902-1 05-11-16 05-11-25 unit a max mm 0.5 a 1 0.25 0.15 0.05 0.00 1.65 1.55 0.35 0.25 0.15 0.05 dimensions (mm are the original dimensions) xqfn8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm b dl e 1 1.65 1.55 e e l 1 v 0.1 0.55 0.5 w 0.05 y 0.05 0.05 y 1 0 1 2 mm scale x c y c y 1 terminal 1 index area terminal 1 index area b a d e detail x a a 1 b 8 7 6 5 e 1 e 1 e e a c b ? v m c ? w m 4 1 2 3 l l 1 metal area not for soldering
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 15 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state 14. abbreviations 15. revision history table 11. abbreviations acronym description cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 12. revision history document id release date data sheet status change notice supersedes 74lvc2g241_6 20060922 product data sheet - 74lvc2g241_5 modi?cations: ? the format of this data sheet has been redesigned to comply with the new presentation and information standard of philips semiconductors. ? added type number 74lvc2g241gm (xqfn8 package). 74lvc2g241_5 20050202 product speci?cation - 74lvc2g241_4 74lvc2g241_4 20040922 product speci?cation - 74lvc2g241_3 74lvc2g241_3 20030311 product speci?cation - 74lvc2g241_2 74lvc2g241_2 20030129 product speci?cation - 74lvc2g241_1 74lvc2g241_1 20021030 product speci?cation - -
74lvc2g241_6 ? koninklijke philips electronics n.v. 2006. all rights reserved. product data sheet rev. 06 22 september 2006 16 of 17 philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .semiconductors .philips .com. 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. philips semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local philips semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, philips semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes philips semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use philips semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a philips semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. philips semiconductors accepts no liability for inclusion and/or use of philips semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale philips semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .semiconductors .philips .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by philips semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 17. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
philips semiconductors 74lvc2g241 dual buffer/line driver; 3-state ? koninklijke philips electronics n.v. 2006. all rights reserved. for more information, please visit: http://www.semiconductors.philips.com. for sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. date of release: 22 september 2006 document identifier: 74lvc2g241_6 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 5 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 16 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 17 contact information. . . . . . . . . . . . . . . . . . . . . 16 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

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